BK Series

Micro-ATX Chassis

12.5L Small Form Factor
Small Case Smart Choice
With easy to integrate, flexible design, excellent performances, and advanced Technology, BK Series a perfect avenue to boost your margins and increase revenue.
Easy Integration
Flexible Compatibility
Excellent Performance
3rd Generation of Partition Plate Cooling Technology (PPCT)

BK623

Specifications

Model
MB Form Factor
Case Size
Color
External Drive Bays
Internal Drive Bays
Front Ports
Product Dimensions
(H x W x D)
Front Panel
Product Dimensions
(H x W x D)
w/o Front Panel
I/O Expansion Slots
Model
Compatibility
Power Supply
Thermal Solution
Safety
Security
Optional
Packing Dimensions
(H x W x D)
Shipping Information
  • BK623
    Micro-ATX / Mini-ITX
    12.5L
    S.F.F Slim Chassis
    • Black
    • White
    5.25" x 1, 3.5" x 1
    3.5" x 1 or 2.5" x 1
    4 (or USB 3.0 x 2, x 2),
    HD Audio
    323 x 140 x 322 mm
    (12.7” x 5.5” x 12.7”)
    323 x 140 x 276 mm (12.5L)
    12.7" x 5.5" x 10.8"
    Full Height Slot x 4
    BK623
    .Maximum Graphics Card Length / Width: 258 mm / 110 mm
    .Maximum CPU Cooler Height: 71 mm
    Standard SFX 12V Form Factor, 300W
    Intel Mt. Jade Ref. Design
    New Partition Plate Cooling Tech (New PPCT)
    No Second Fan (Rear Fan) Needed
    Meets RoHS, CE and FCC Class B Requirements
    Padlock Loop / Kensington Slot
    Removable Air Filter
    IEEE 1394
    IR
    Chassis Intrusion Switch
    Screwless ODD/FDD/HDD Bays Clips
    Screwless Expansion Slots Clip
    Screwless Side Cover Clips
    2
    3.5” to 2.5” HDD/SSD Bracket
    Key Lock Side Panel
    400 x 408 x 193 mm
    15.7" x 15.7" x 7.6
    Single Packing:
    -20’: 910, 40’: 1,885 40’ H: 2,230
    Single Packing + Pallets:
    -20’: 675, 40’: 1,500, 40’ H: 1,500
* Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
* The actual product is subject to change without prior notice. In Win Development Inc. right to make final modifications.

BK623

12.5 Liters Small Form Factor Design

Design Philosophy
To design a small 12.5L SFF chassis with better thermal & acoustic performance than other bigger size chassis

 
 

Gallery

BK623

Specifications

•Easy
Compatible with all standards for desktop components. Easy system integration.
•Flexible
Small but flexible enough to accommodate four full height PCI cards.
•Excellent
Meets 65W 2006 FMB thermal target for Intel®  Core™ without any case fan. Meets 30 dB(A) or 3.5 BA of system acoustic target in idle mode (Lower processor power, C1E enabled & iQST implemented for Conroe on 965/ICH8 platform).

Designed to fit standard Micro-ATX motherboards for easy system integration.

Detachable 5.25” optical drive bracket for easy installation.

Standard SFX 12V 250W & 300W power supply platform offers high performance / low power solution.

Designed for Digital Home and Digital Office. Supports 4xfull height slots for GFX / TV tuner cards.

Optional removable air filter.

Optional screwless designs-ODD/FDD/HDD bays, expansion slots and top cover clips for easy installation.

Tool-Free

Screwless ODD Bay Clips

Screwless FDD Bays Clips

Screwless HDD Bays Clips

Screwless Expansion Slot Clip

Screwless Top Cover Clips

Excellent Thermal Solution

•Intel Mt. Jade Ref. Design •New Partition Plate Cooling Technology (New PPCT)
•No 2nd Fan (Rear Fan) Needed •Additional ventilation holes on the side panel

Front Ports

‧USB 2.0 x 4
‧HD Audio
‧Optional IEEE 1394
‧Optional USB 3.0 x 2

Partition Plate Cooling Technology (PPCT)

More
 

3rd Generation of Partition Plate Cooling Technology (PPCT)

The 3rd generation of PPCT includes an adjustable air duct for various CPU fans and efficiently eliminates overheat while enhances airflow of entire system.- No second fan needed. - Supports LGA1155 Socket and downward compatible (LGA775 / LGA1156)

•Adjustable Partition Plate Cooling Tech accommodates different motherboards and provides the optimal thermal performance.

‧Enlarged Vent

‧Removable Air Duct

‧Adjustable Position

* New PPCT Technology supports LGA1155 Socket and downward compatible(LGA775).

Partition Plate Cooling Technology (PPCT)

-This Partition Plate Cooling Technology is the world’s most advanced thermal & acoustic technology, which provides SFF chassis with excellent thermal solutions while creating a quieter computing experience.
- The innovative partition plate cooling technology (PPCT) is the world’s first complete thermal solution co-designed by IN WIN and Intel.
- By separating the CPU fan from the heatsink to reduce back draft, PPCT efficiently streamlines the airflow in a unilateral direction to provide exceptional thermal performance.

BK Series uses Intel Mt. Jade Ref. Design

Partition Plate to Guide Air Flow

This product is recommended to use with Intel boxed CPU cooler.

Better Acoustic Performance

System Acoustic <30 dB(A) and 3.5 BA Lower Power – 50% lower TDP
All sound power data listed is “Measured LwA” data according to ISO 7779 standard at room temperature of 23°C ±2°C

System Acoustic Result

‧Sound Power
Maxpower 85%: 4.2 BA
Idle: 3.5 BA

‧Sound Pressure
Maxpower 85%: 35 dB (A)
Idle: 30 dB (A)

System Thermal Result

Cooler Fan Speed 2684 RPM Gfxcard with Active Fansink
CPU Core™ 2 Duo E6700 (2.66GHz)
Ambience Temperature 35℃
Tcase of CPU 57.22
Ta average 37.16
PSU out 47.2℃(117℉)
ICH8 TOP 47.77
MCH 46.49
DIMM 43.79
HDD 49.24
SYSTEM IN 35.00
VGA 46.68
Tcase projected to 65W TDP 58.61
Margin to 60.1C Spec 1.49

*Source from Mt. Jade Ref. Design, co-work by In Win and Intel. All examine source are subject to change in anytime, without notice.
*Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of IN WIN products as measured by those tests.
Any difference in system hardware or software design or configuration may affect actual performance.

Q & A

Heatsink Solution for BK623(Mt Jade) chassis

Q. How to select a proper heatsink for Mt. Jade / BK Series ?
A. (1)Use Intel boxed heatsink or
(2)Select a Radial-fin heatsink (similar to the boxed fan heatsink solution from Intel).
Here is a list of 3rd Party thermal solutions per processor from Intel’s website

Optional

•IR •Removable Air Filter
•Chassis Intrusion Switch •Screwless ODD/FDD/HDD Bays Clips
•Screwless Top Cover Clips

•Key Lock Side Panel
The side panel is a theft deterrent key lock set for safeguarding your chassis equipment from unauthorized access.

3.5" to 2.5" HDD/SSD Bracket
Supports 2.5" x 2

Optional 60 mm Fan x 1
(60 x 60 x 10 mm, 2500rpm, 20dB Fan, 4 Pin Power Connector)

Recommended Power Supply

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